Incredibly powerful! Testing the Nano Banana Pro: I don't even want to call it AI; this is visual-level AGI!

谷歌推出了 Nano Banana Pro，基於 Gemini 3 Pro Image 模型，具備視覺層面的 AGI 能力。它能將複雜信息轉化為視覺格式，理解物理、代碼、財報、生物等領域。測試顯示其壓縮算法和渲染能力極強，能將論文變成板書、代碼變圖、博客變雜誌，展現出卓越的文字排版和硬核知識庫。

昨晚谷歌繼 Gemini 3 pro 後又扔出了王炸——Nano Banana Pro（核心就是 Gemini 3 Pro Image 模型）

nano banana 已經很厲害了，pro 是 Gemini 3 pro 的大腦直接長出了眼睛和手。它不僅能看懂你在説什麼，它甚至比你更懂物理、懂代碼、懂財報、懂生物！

以下是外網大神們測出來的 名場面

1.文字與邏輯的 “降維打擊”：人類歷史上最強的壓縮算法

Nano Banana Pro 的渲染能力，讓我覺得以前用的都是假 AI

案例一：論文秒變板書

直接把一篇枯燥的學術論文扔進去，要求把它變成教授講課的白板。

提示詞：把這篇論文變成教授的白板板書圖像：要有圖解、箭頭、框圖，以及解釋核心概念的視覺説明。使用彩色繪製

這裏我們把《Attention Is All You Need》論文扔進去，結果？你們自己看：

這不僅是畫得像，它是真的讀懂了論文！拼寫，箭頭邏輯、核心概念解釋……！這基本上是人類歷史上最強的壓縮算法

案例二：代碼直接變圖

更騷的來了，有人餵給它一段 Gemini 3 生成的 AI 計算提交記錄的 原始 Graphviz 代碼（DOT 語言代碼）。注意，是代碼！

它都不帶喘氣的，直接一次性渲染出了帶 Logo 的完美圖表

案例三：博客變雜誌

文字排版能力也是天花板級別。把 Gemini 3 發佈官方的技術博客扔進去，讓它生成一張 “放在桌上的精美雜誌內頁”

提示詞：把整段文字逐字逐句地放入一張放在桌上的光面雜誌文章照片中，要有照片、精美的排版設計、引語和大膽的格式

看這排版、這引語設計，你説這是設計大師排了一下午我都信

2. 它真的 “懂” 這個世界（硬核知識庫）

以前的 AI 是瞎蒙，Nano Banana Pro 是真懂。因為它背後連着 Google Search 和 Gemini 3 的推理大腦

案例四 & 五：硬核工藝與生活幽默

看看這個關於「PCB 電路板製造全流程」的圖。這可是硬核工業流程！

提示詞：

Explain all the steps in PCB manufacturing: 1. Design & Output: Creation of schematic and layout (Gerber files). 2. DFM Check: Design for Manufacturability review to catch errors. 3. Film Generation: Laser plotting of photo films for each layer (or Laser Direct Imaging). 4.  Surface Preparation: Cleaning and roughening the copper laminate.  5.  Inner Layer Imaging: Applying photoresist and exposing it to UV light to define traces. 6.  Etching: Chemical removal of unwanted copper, leaving only the circuitry.  7.  Resist Stripping: Removing the hardened photoresist.  8.  AOI (Automated Optical Inspection): Scanning inner layers for shorts or opens.  9.  Oxide Application: Chemical treatment to improve bond strength between layers. 10. Lamination: Stacking layers with epoxy (prepreg) and bonding them under heat and pressure. 11. Drilling: Computer-controlled drilling of vias and mounting holes.  12. Desmearing: Chemical removal of resin residue from drill holes.  13. Electroless Copper: Depositing a thin layer of copper to make hole walls conductive.  14. Panel Plating: Thickening the copper layer in the holes and on the surface. 15. Outer Layer Imaging: Applying photoresist to define the outer circuit pattern.  16. Pattern Plating: Plating additional copper onto exposed traces and holes, followed by Tin Plating (which acts as an etch resist).  17. Resist Stripping: Removing the photoresist to expose the unwanted copper.  18. Etching: Removing the unwanted copper (the tin protects the desired circuitry).  19. Tin Stripping: Chemically removing the protective tin layer. 20. Solder Mask: Applying UV-curable ink (usually green) and exposing it to define solderable areas.  21. Silkscreen: Printing component legends, logos, and text (white ink).  22. Surface Finish: Applying a conductive finish to exposed pads. 23. Electrical Testing: Checking for electrical continuity and isolation (Flying Probe or Bed of Nails).  24. Profiling: Cutting individual boards from the production panel (V-scoring or Routing).  25. Final QC: Visual and dimensional inspection before packaging.