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台媒：苹果自研 5G 基带芯片将采用台积电 3 纳米制程

JIN10
2023.03.06 01:59
金十数据 3 月 6 日讯，据界面新闻援引台媒报道，苹果自研 5G 基带芯片研发代号为 Ibiza，将采用台积电 3 纳米制程，配套射频 IC 会采用台积电 7 纳米制程，业界现阶段预期会导入苹果 2024 年推出的 iPhone16 系列手机。由此推算，台积电最快今年下半年就会开始为苹果进行试产，明年上半年逐步拉高投片量。据悉，高通 CEO 安蒙 (Cristiano Amon) 近日出席 2023 年世界移动通信大会 (MWC2023) 时表示，苹果可能在 iPhone16 系列搭载自研 5G 基带芯片。
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