消息稱 SK 海力士為應對 HBM 需求激增 擬增加封裝技術人員

智通財經
2023.08.25 06:13
SK 海力士正在內部招聘 “後處理” 人員，以擴大生產規模。半導體行業消息人士 24 日透露，SK 海力士的晶圓級封裝部門最近決定重新分配和加強封裝技術人員，該部門負責下一代封裝技術的開發和大規模生產。人員的增加是為了應對人工智能投資激增所帶來的對 HBM 快速增長的需求。
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