Strong demand from TSMC for tariff-related rush orders have completely filled wire bonding, Flip-Chip packaging and bumping capacity at ASE Technology, the semiconductor packaging and testing giant, media report, citing unnamed supply chain sources. End-customers are trying to get ahead of US tariffs, before the end of the 90-day suspension, by pulling forward orders originally meant for the 2nd half of the year. $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) #semiconductors #semiconductor
Source: Dan Nystedt
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