Rumor: TSMC Arizona may add 2 more advanced packaging plants to meet strong demand from AI clients like Nvidia, in addition to the two already announced, media report, citing unnamed supply chain sources, while also building more such plants in Taiwan. TSMC’s gross margin for advanced packaging is said to be around 80%, compared to 60% for its overall business. To better keep pace with rapid expansion plans, TSMC reportedly plans to appoint a new business head, Chen Cheng Hsien (陳承先), current head of SoIC of Operations. $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) $BESI #Arizona #Semiconductors #semiconductor
Source: Dan Nystedt
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