Taiwan's National Institutes of Applied Research (NIAR) announced an open R&D platform for a new advanced packaging technique aimed at eliminating the substrate by placing the interposer directly on the circuit board, a process it calls CoCoB (Chip-on-Chip-on-Board). The biggest challenge is surface unevenness on the board caused by solder balls. NIAR used a flowable interface material under each solder ball to ensure bonding to all connection points. Removing the substrate reduces cost and shortens the signal path, among other benefits. #semiconductors
Source: Dan Nystedt
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