TSMC’s massive AP7 advanced packaging plant in Chiayi, south Taiwan, can host a total of 8 phases: Phase 1 where equipment installation is going on now, Phase 2, which is set for mass production this year, and room for at least 6 additional phases, media report. Apple chips are expected to use WMCM (Wafer-level Multi-Chip Module) packaging in Phase 2 of the plant. TSMC gave a media tour of the plant on Thursday. $Taiwan Semiconductor(TSM.US) $Apple(AAPL.US) $NVIDIA(NVDA.US) $AMD(AMD.US)
Source: Dan Nystedt
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