Powertech plans to spend NT$44.3 billion (US$1.4B) over 3-years to expand advanced semiconductor packaging called FOPLP (Fan-out Panel Level Packaging) as AI-related demand continues to surge, media report, adding subsidiary TeraPower will add 400 to 500 new testing machines to support the FOPLP buildout (wafer and final testing). #Powertech $Advanced Semiconductor Engineering(ASX.US) $Taiwan Semiconductor(TSM.US)
Source: Dan Nystedt
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