TSMC’s first pilot line for CoPoS advanced packaging will be up in June at its main R&D center, using glass substrates to replace silicon interposer, media report, adding it features a completely localized supply chain. TSMC began installing the Chip-on-Panel-on-Substrate (CoPoS) line in February and aims for mass production in 2028-2029. TSMC aims to boost production and cut costs for AI chip clients with CoPoS. AI chips are much bigger now, more suited to panels instead of wafers, and glass substrates instead of silicon interposers. $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) $AMD(AMD.US) $Broadcom(AVGO.US) $Alphabet(GOOGL.US) $Amazon(AMZN.US) #AblePrint #AMC #semiconductors #Japan

Source: Dan Nystedt