TSMC plans to invest tens of billions of Taiwan dollars in a new advanced chip packaging plant in the Central Taiwan Science Park near Erlin Township, media report, adding that equipment move-in at the expansion of TSMC’s AP5B plant nearby is expected to be done by end-2026. It will do CoWoS-L. TSMC has not submitted paperwork for the land yet, but is expected to do so soon. 1/2 $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) #SPIL $Advanced Semiconductor Engineering(ASX.US) #semiconductors
Source: Dan Nystedt
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