Korea continues to import WFE equipment as it expands and upgrades existing fab capacity. Etch, in particular, has clearly been an area of focus.But sometimes the data points to a more nuanced picture. Within Etch, the growth story is overwhelmingly concentrated in Dry/Plasma Etch.Why? 👉The dry etch surge lines up with SK Hynix's M15X and Samsung's P4 ramps, and the HBM buildout compounds it: TSV etch adds an extra dry etch step vs conventional DRAM, structurally raising dry etch intensity per wafer.Biggest beneficiary? 👉Lam Research - dominant in memory dry etch, and the TSV etch steps that HBM adds only deepen its exposure.Source: Chips &amp; Wafers