The Sci-Tech Innovation Chip Design ETF Puyin (589250) rose 2.58% against the trend in the morning session, focusing on design with high elasticity.

As of 9:32, the Puyin Science and Technology Innovation Chip Design ETF (589250) rose 2.58%; among the sample stocks, Hygon Information, Montage Technology, and Loongson Technology rose over 6%, while Chipsea Technology, Novosense, and Centec Communications also gained.

Wind data shows that as of April 23, the Shanghai Science and Technology Innovation Board Chip Design Theme Index tracked by the Puyin Science and Technology Innovation Chip Design ETF (589250) has risen 70.05% in the past year.

On April 22 local time, TSMC announced its future process roadmap at the 2026 North America Technology Symposium, stating that the A13 (equivalent to 1.3nm) and A12 (equivalent to 1.2nm) processes are expected to enter mass production in 2029. Among them, A13, as an optical shrink version of A14, is fully design rule compatible, reducing chip area by 6%; A12 introduces the Super Power Rail (SPR) backside power delivery technology, specifically crafted to meet the extreme demands of Artificial Intelligence (AI) and High-Performance Computing (HPC).

Earlier, TSMC released its financial report. In the first quarter of this year, the company's net profit reached NT$572.5 billion, hitting a record high, a year-on-year increase of 58.3%; the gross profit margin climbed to 66.2%, up nearly 4 percentage points from the previous quarter. Looking at the revenue structure, advanced processes have become the absolute growth engine: 3nm and 5nm processes contributed 25% and 36% of wafer sales revenue respectively, while the 7nm process accounted for 13%. The overall revenue share of processes including 7nm and more advanced ones reached as high as 74%.

Soochow Securities points out that the rapid iteration of large model technology is driving computing power chip demand into a super cycle. Trendforce expects the penetration rate of ASIC custom chips to climb from 27.8% in 2026 to nearly 40% in 2030. The diversified competitive landscape and overall prosperity of the AI chip market are experiencing a historic boost.

The Puyin Science and Technology Innovation Chip Design ETF (589250) closely tracks the Shanghai Science and Technology Innovation Board Chip Design Theme Index (950162), highly focusing on 50 listed chip design companies on the Science and Technology Innovation Board, with digital chip design accounting for nearly 80% of the weight. It avoids segments such as semiconductor materials/equipment, manufacturing, and packaging/testing. Within the chip sector, it has a lower valuation compared to the semiconductor materials index, better aligning with industrial development trends.

In terms of volatility, the Shanghai Science and Technology Innovation Board Chip Design Theme Index only includes chip design companies listed on the Science and Technology Innovation Board, with constituent stocks having a daily price fluctuation limit of ±20%, offering greater volatility and stronger offensive capability.

In terms of growth, the Puyin Science and Technology Innovation Chip Design ETF (589250) tracks the Shanghai Science and Technology Innovation Board Chip Design Theme Index. During the period from January 5, 2024, to March 30, 2026, the underlying index cumulatively rose 141.86%, making it the top-performing chip industry theme index, surpassing the Science and Technology Innovation Chip Index (133.60%), CSI All Share Semiconductor Index (97.77%), and the Semiconductor Materials & Equipment Index (98.39%).