苹果 M5 系列芯片 1. M5 系列芯片将采用台积电先进的 N3P 节点,该节点几个月前已进入原型阶段。M5、M5 Pro/Max 和 M5 Ultra 预计分别在 1H25、2H25 和 2026 年量产。 2. M5 Pro、Max 和 Ultra 将采用服务器级 SoIC 封装。苹果将使用称为 SoIC-mH(水平成型)的 2.5D 封装来提高生产良率和散热性能,并具有独立的 CPU 和 GPU 设计。 3. 高端 M5 芯片量产后,苹果的 PCC 基础设施建设将加速,更适合 AI 推理。$苹果 (AAPL.US)
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