Apple M5 series chips
1. The M5 series chips will adopt TSMC's N3P process, entered prototype stage several months ago, and are expected to be mass-produced in 1H25 for M5, 2H25 for M5 Pro/Max, and 2026 for M5 Ultra.
2. M5 Pro, Max and Ultra will adopt server-grade SoIC packaging. To improve production yield and thermal performance, Apple uses a 2.5D packaging called SoIC-mH (molding horizontal) with separated CPU and GPU design.
3. Apple PCC infrastructure construction will accelerate with the mass production of high-end M5 chips as they are more suitable for AI inference.$Apple(AAPL.US)
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